The company LG Electronics announced the features of self-camera flagship smartphone LG G8 ThinQ, which will be presented at the exhibition MWC-2019 in Barcelona in a couple of weeks.
Thanks to the joint efforts of LG and the companyInfineon Technologies AG has incorporated the sensor chip REAL3TM, a ToF camera (Time-of-Flight) for 3D scanning, into the front camera system of the device. This innovative sensor will provide a new level of smartphone front camera capabilities.
The ToF image sensor chip does not needcomplex algorithms for calculating the distance to the object - the measurement accuracy is ensured by capturing infrared light reflected from the object. At the same time reduces the load on the processor and, consequently, power consumption.
Since the ToF technology “sees” objects in 3D andits effect is not reduced due to light from external sources; a high recognition rate is ensured in any conditions. This is promising in terms of working with Augmented Reality (AR) and Virtual Reality (VR).
That is, you can absolutely accurately predict that one of the LG G8 ThinQ chips will be entertainment with AR self-processing.