Adhesive joints are one of the mostcommon assembly methods used in modern industry, medicine and construction. The use of epoxy adhesives ranges from smartphones and children's toys to satellite parts and human organs.
Traditionally, such adhesives harden whenexposure to moisture, temperature and light, which reduces the effectiveness of the use of adhesive compounds in many industrial processes. However, the development by Singaporean scientists of a non-contact, remote curing method using alternating magnetic fields (AMF) allows for energy-efficient adhesion on demand.
The new adhesive contains specially formulatedmetal nanoparticles (Mnx Zn 1-x Fe2 O4). Magnetic nanoparticles (CNP), under the influence of AMF magnetic fields, heat the adhesive to the required temperature for bonding. The use of the controlled curing technique of the adhesive with magnetic particles requires less energy, improves the manufacturability of the adhesive joints and allows to achieve an overlapping shear bond strength of over 6.5 MPa.
Application of epoxy adhesives when joininglarge parts made of carbon fiber require long-term thermal ovens. However, in order to achieve similar parameters of an adhesive bond based on CNP particles, it is required to operate the device generating an alternating magnetic field for several minutes.
Internal temperature 160 ° C can bereached in 5 minutes, allowing most commercial epoxy adhesives to cure without resin sticking. At the same time, traditional work with glue, to harden 1 gram of resin, requires a 2 kW oven for an hour. Curing a similar amount of resin with magnetic nanoparticles requires a 200W device and runs for 5 minutes. As a result, energy consumption is reduced by 120 times.
The use of the new technology has been tested on wood, ceramics and plastics, generating significant interest in the application of the technique in the sports, automotive and aerospace industries.